The key to the efficiency and quality of today’s chips lies in their extraordinarily high purity. Large parts of their production are therefore realised in clean rooms ranging from Class 10 upwards in which a maximum of 10 particles per m³ air may occur. The demands made of the materials used are also high, particularly those that are in immediate contact with the silicon. This entails the almost exclusive use of quartz glass, CFC composite materials and graphite (which are also produced at comparably high purity levels). This applies in particular to production of single silicon crystals. In addition to the materials mentioned, ultra-pure ceramics (in part coated) and metals are also used during further processing of Si wafers.
| Single Crystal Growth
CZ procedure from the molten mass to the monocrystal» proceed
| Wafer Processing
Wafer handling during lithography, epitaxy, CVD» proceed